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? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 4.2v to 18v, 3a 1ch s ynchronous buck converter with i ntegrated fet bd932 9a efj general description the bd 9329aefj is a synchronous step - down switching regulator with built - in two low - resistance n-c hannel mosfets. this ic can supply continuous output current of 3a over a wide input r ange , and provides not only fast transient response, but also easy phase compensation because of current mode control. features ? uses low esr output ceramic capacitors ? lo w stan d by current ? 380 khz fixed operating frequency ? feedback v oltage ? 0.9v 1.5%(ta=25 c) ? 0.9v 2.0 %(ta= -25 c to + 85 c) ? under voltage p rotection ? thermal s hutdown ? over current p rotection applications distributed power system s pre-r egulator for linear regulator s key specifications ? i nput v oltage r ange : 4.2 v to 18 v ? o utput v oltage r ange : 0.9 v to (v in x 0.7)v ? o utput current: 3.0 a (max) ? switching frequency 380k hz(typ) ? hi -s ide fet o n-r esistance: 0.15 (typ) ? lo-s ide fet o n-r esistance: 0.13 (typ) ? s tandby current: 15 a (typ) ? operating temperature range : - 40 c to +85 c package w (typ) d (typ) h (max) typical application circuit r_bs protect s from v in - bst short destruction. fig ure 1. typical application circuit c_co1 r _ pc 7.5k r_up c_bs 0.1 f 10 h c_vc 1 10 f c _pc 3300pf r_dw 10 k 27k f f l ss en comp fb bst vi n gnd sw thermal pad (to be shorted to gnd) v in = 12v v out = 3.3v r _bs 22 htsop - j8 4.90mm x 6.00mm x 1.00mm product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays 1/ 19 datashee t
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 pin configuration block diagram fig ure 2 . pin configuration fig ure 3 . block diagram pin description pin no. pin n ame function 1 bst high - s ide g ate d rive b oost i nput 2 v in power i nput 3 sw power s witching o utput 4 gnd ground 5 fb feed b ack i nput 6 comp compensation n ode 7 en enable i nput 8 ss soft s tart c ontrol i nput (top view) bst vin sw gnd fb comp en ss v in v in 2 / 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 absolute maximum ratings ( ta = 25 c ) parameter symbol rating unit supply voltage v in 20 v switch voltage v sw 20 v power dissipation for htsop -j8 pd 3 . 76 (note 1 ) w package thermal resistance ja (note 2 ) ja 29.27 c /w package thermal resistance jc (note 2 ) jc 3.75 c /w operating temperature range topr - 40 to + 85 c storage temperature range ts t g - 55 to + 150 c maximum junction temperature tjmax 150 c bst voltage v bst v sw +7 v en voltage v en 20 v all o ther p ins v oth 20 v (note 1 ) reduced by 30.08 mw/ c over 25 c (mount on 4 - layer 70.0mm x 70.0mm x 1.6mm board) (note 2 ) mount on 4 - layer 50mm x 30mm x 1.6mm application board caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions ( ta = -40c to + 85c ) parameter symbol rating unit min typ max supply voltage v in 4.2 12 18 v sw voltage v sw - 0.5 - + 18 v output c urrent i sw3 - - 3 a output v oltage r ange v range 0.9 - v in x 0.7 v electrical characteristics ( unless otherwise specified v in =12v ta=25 c ) parameter symbol limit unit conditions min typ max error a mplifier b lock fb i nput b ias c urrent i fb - 0.02 2 a feedback v oltage1 v fb1 0.886 0.900 0.914 v voltage f ollower feedback v oltage2 v fb2 0.882 0.900 0.918 v ta = -25c to + 85c sw b lock ? sw hi -s ide fet o n -r esistance r onh - 0.15 - i sw = - 0.8a lo-s ide fet o n -r esistance r onl - 0.13 - i sw = 0.8a hi/lo -s ide fet leak c urrent i leakn - 0 10 a v in = 18v, v sw = 0v / 18v switch current limit i limit3 3.5 - - a maximum d uty c ycle m duty - 90 - % v fb = 0v general enable sink c urrent i en 90 180 270 a v en = 12v enable threshold v oltage v en 1.0 1.2 1.4 v under voltage lockout t hreshold v uvlo 3.5 3.75 4.0 v v in r ising under voltage lockout hysteresis v hys - 0.3 - v soft start current i ss 5 10 15 a v ss = 0v soft start time t ss - 22 - ms c ss = 0.1 f operating frequency f osc 300 380 460 khz circuit current i cc - 1.2 3 ma v fb = 1.5v, v en = 12v standby current i qui - 15 27 a v en = 0v 3 / 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 typical performance curves (unless otherwise specified, v in = 12v ta = 25 c ) fig ure 7 . feedback v oltage vs temperature fig ure 4 . circuit current vs input voltage (no s witching) fig ure 5 . standby c urrent vs input voltage ( shutdown mode) fig ure 6 . input bias current vs feedback voltage i cc (ma) v in [ v ] i cc ( a) v in [ v ] i fb ( a) v fb [ v ] temp [ c ] 4 / 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 typical performance curves - continued fig ure 8 . hi - side , low - side fet o n - r esistance vs temperature fig ure 9 . operating frequency vs temperature fig ure 10. step - down efficiency vs i o (v in = 12v v out = 3.3v l=10h) fig ure 11 . soft start time vs c ss r on (
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 typical waveforms fig ure 1 2 . over current protection (v out is shorted to gnd) fig ure 13. transient response (v in = 12v , v out = 3.3v , l= 10h , c out =22f , i out = 0.2 a- 1.0a) fig ure 15. transient response (v in = 12v , v out = 3.3v , l= 10h , c out =22f , i out = 0.2 a - 3.0a) fig ure 14. output ripple voltage (v in = 12v , v out = 3.3v , l= 10h , c out =22f , i out = 1.0a) i out 6 / 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 typical waveforms - continued fig ure 17. start -u p w aveform (v in = 12v , v out = 3.3v , l= 10h , c ss = 0.1f) fig ure 16. output ripple voltage (v in = 12v , v out = 3.3v , l= 10h , c out = 22f , i out = 3. 0a ) t ss 7 / 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 application information 1. typical application circuit r_bs protect from v in - bst short destruction. fig ure 1 8 . typical application circuit symbol maker part no input c apacitor c_vc1 tdk c3225jb1e106k 10f/25v output c apacitor c_co1 tdk c3216jb1c106m 10f/16v inductor l tdk slf10165 - 100m3r8 10h/3.8a c_bs 0.1 f v out = 3.3v r _bs 22 v in = 12v c_co1 r_up 10 h c_vc 1 10 f c _pc 3300pf r_dw 10 k 27k f f l ss en comp - fb bst v in gnd sw thermal pad (to be shorted to gnd) r _ pc 7.5k 8 / 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 2. block operation (1) vreg this block generates a constant voltage for dc/dc boosting. (2) vref this block generates an internal reference voltage of 5.1 v (typ). (3) tsd/uvlo tsd (thermal shutdown)/uvlo (under voltage lockout) protection block. the tsd circuit shuts down the ic at high temperature. the uvlo ci rcuit shuts down the ic when the v in voltage is l ow. (4) error amp block (err) this block compares the reference voltage and the feedback voltage from the output. the output voltage of this block, which is connected to comp pin, determines the switching duty cycle. at the time of start up , since the soft - start is operated by the ss pin voltage, the comp pin voltage is limited to the ss pin voltage. (5) oscillator block (osc) this block generates the oscillating frequency. (6) slope block this block generates the tria ngular wave form with the use of the clock created by osc. the generated triangular wave form is sent to the pwm comparator. (7) pwm block the comp pin voltage output of the error amp is compared with the slope block's triangular waveform to determine the switc hing duty. since the switching duty cycle is limited by the maximum duty ratio which is determined internally, 100% duty cycle cannot be achieved. (8) drv block this is the a dc/dc driver block that accepts signal from the pwm block to drive the p ower fets. (9) ocp block ocp (over current protection) block. the current that flow s through the fet s is detected , and ocp starts when it reache s 3.5a (min). after ocp detection , switching is turned off and the ss capacitor is discharged. ocp is self - recovery type ( not latch ). (10) soft -s tart circuit this circuit prevents output voltage overshoot or inrush current by making the output voltage rise gradually while restricting the current at the time of startup. 9 / 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 3. selecting application components (1) output lc f ilter c onstant s election (buck converter) the o utput lc filter is required to supply constant current to the output load. a larger inductance value at this filter results in less inductor ripple current (? i l ) and less output ripple voltage. however, inductors with large v alues tend to have slower load transient - response, a larger physical size, a lower saturation current , and a higher series resistance. a smaller value of inductance has almost opposite characteristics as above. so , c hoosing the inductor ripple current (? i l ) between 20 % to 40% of the averaged inductor current ( equivalent to the output load current) is a good compromise. fig ure 19 fig ure 20 setting ? i l = 30% x averaged inductor c urrent (2a) = 0.6 [a] where : v in = 12v, v out = 3.3v, f osc = 380 khz, f osc is the switching frequency also the inductor should have higher saturation current than i outmax + ? i l / 2. t he output capacitor c out affects the output ripple - voltage. choose a high - value capacitor to achieve a small er ripple - voltage that is enough to meet the application requirement. output ripple voltage ? v rpl is calculated using the following equation : w here : r esr is the parasitic series resistance of the output capacitor. setting c out = 20f, r esr = 10m (2) loop compensation choosing compensation capacitor c cmp and resistor r cmp the current - mode buck converter has 2 - poles and 1- zero system. choosing the appropriate compensation resistor and capacitor is important to achieve good load - transient response and good stability. an example of a dc/dc converter application bode plot is shown in figure 22 . the compensation resistor , r cmp , determines the cross - over frequency f crs (the frequency where the total dc -dc loop -g ain falls to 0db). setting a higher cross - over frequency achieve s good response speed, but less stability. on the other hand , setting the cross - over frequency to a lower value may result to better stability , but poorer response speed. setting the cross - over frequency to 1/10 of the switching frequency shows good performance at most applications. i l t i out max + ? ( ) [ ] h i f v v v v l l osc in out in out = ? ? = [ ] v f c r i v osc out esr l rpl ? ? ? ? ? ? ? ? + ? = ? ? mv k m v rpl 8 . 15 )) 380 20 8 /( 1 10 ( 6 . 0 = + = ?
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 (a) choosing phase compensation resistor r cmp the compensation resistor r cmp can be calculated using the following formula : w here : v out is the output v oltage f crs is the cross o ver f requency c out is the output capacitor v fb is the i nternal f eedback v oltage ( 0.9v (typ) ) g mp is the current sense gain ( 7.8a/v (typ) ) g ma is the error amplifier tran s conductance ( 300a/v (typ) ) setting v out = 3.3v, f crs = 38khz, c out = 20f; (b) choosing phase compensation capacitor c cmp for the stability of the dc/dc converter, cancel lation of the phase delay that is drawn from the output capacitor c out and resistive load r out is possible by inserting the phase advance. the phase advance can be added by the zero on compensation resistor r cmp and capacitor c cmp . making f z= f crs / 6 gives a first - order estimate of c cmp . compensation capacitor setting f z = f crs /6 = 6.3khz; compensation capacitor however, the best values for zero and f crs differ between applications. decide the values accordingly a fter calculation using the formula above and c onfirmation on the actual application . (c) the condition of the loop compensation stability the stability of dc/dc converter is important. to secure operati on stability, check if the loop compensation has enough phase - margin. for the condition of loop compensation stability, the phase - delay must be less than 150 degree s at 0 db gain . feed - forward capacitor c rup boosts phase margin over a limited frequency range and is sometimes used to improve loop response. c rup will be more effective if r up >> r up ||r dw fig ure 2 1 fig ure 22 (3) design of feedback resistance constant set the feedback resistance as shown below. fig ure 23 v out r up c cmp comp r cmp fb r dw 0.9v c ru p v out r1 r2 err 0.9v fb [ ] ? = [ ] = + = ? = = ? ? ? = =
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 4. soft start function an adjustable soft - start function to prevent high inrush current during start - up is available. the soft - start time is set by the external capacitor connected to ss pin. the soft - start time is given by; the c harge time of c ss t he ss terminal rising time setting c ss = 0.1f please confirm the overshoot of the output voltage and inrush current in deciding the ss capacitor value. 5. en function the en terminal control s the ic?s shutdown. leaving en terminal open shuts down the ic. to start the ic, en terminal should be connected to v in or other power source output. when the en voltage exceeds 1.2v (typ), the ic start s operating. (attention) if the falling edge of en input is too slow, output chattering occurs. this may cause large inverse current from output to input to flow and v in voltage to increase, leading to destruction of the ic. th us, set the fall time of en signal within 100 s when controlling the on/off operation of the ic . this requirement is not needed when en pin is connected with v in and en is not controlled. as a recommendation, c ontrol en with an open drain mosfet connected as shown on fig ure 25. fig ure 25 v in en 66 k fig ure 24 [ ] ss ss ss i c s t / 2 . 2 = ren on /off signal en r en [ ] ss ss ss i c s t / 6 . 0 1 = [ ] ss ss ss i c s t / 6 . 1 2 = ] [ 22 10 / 1 . 0 ) 6 . 1 6 . 0 ( ] [ ms s t ss = + =
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 c in fet c out l v out v in 6. layout pattern consideration two high pulsing current loops exist in the buck regulator system. the first loop, when fet is on, starts from the input capacitors, to the v in terminal, to t he sw terminal, to the inductor, to the output capacitors, and then returns to the input capacitor through gnd. the second loop, when fet is off, starts from the low fet, to the inductor, to the output capacitor, and then returns to the low fet through gnd . to reduce the noise and improve the efficiency, please minimize these two loop area s . the input capacitor, output capacitor , and the low fet should be connected to the pcb?s gnd plain . pcb layout may greatly affect the thermal performance, noise , and efficiency. so , please take extra care when designing pcb layout patterns. (1) the thermal pad on the back side of the ic offers great thermal conduction to the chip. so , using the gnd plain on the pcb as broad and wide as possible can help thermal dissipation. and a lot of thermal via for helping the spread of heat to the different layer s is also effective. (2) the input capacitors s hould be connected as close as possible to the vin terminal. (3) when there is an unused area on the pcb, please arrange the copper foil plain of dc nodes, such as gnd, v in and v out for better heat dissipation of the ic or circumference parts. (4) to avoid the n oise influence from ac co upling with the other line s , keep the switching line s such as sw as short as possible, and coil traces as short and as thick as possible. (5) keep sensitive signal traces such as trace s connected to fb and comp away from sw pin. (6) th e inductor and the output capacitors should be placed close to sw pin as much as possible. fig ure 26 . current l oop in buck r egulator s ystem fig ure 27 . the e xample of pcb l ayout p attern comp bst v in sw fb ss en gnd c out l v out c in 13/ 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 i/o equivalen ce circuit 1.bst 3.sw 5.fb 6.comp 7.en 8.ss fig ure 28. i/o equivalen ce circuit power dissipation v in v in sw reg v in v in v in v in v in 150 0 50 75 100 125 2000 4000 1000 3000 2 5 power dissipation: pd [mw ] ambient temperature: ta [ c ] (1)820mw (2)1100mw (3)2110mw (4)3760mw 0 htsop - j8 package on 70mm x 70mm x 1.6 mm glass epo xy pcb (1) 1 - layer board ( backside c opper foil area 0 m m x 0 mm) (2) 2 - layer board ( backside c opper foil area 15 mm x 15 mm) (3) 2 - layer board ( backside c opper foil area 70 mm x 70 mm) (4) 4 - layer board ( backside c opper foil area 70 mm x 70 mm) 14/ 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply p in s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using ele ctrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large- current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deter ioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a stron g electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly a nd use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shor ted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 15/ 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 operational notes ? continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from th e outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be co nnected to the power supply or ground line. 12. regarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p l ayers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes t o operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 29 . example of monolithic ic structure 13. thermal s hutdown c ircuit(tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no c ircumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 14. over c urrent p rotection c ircuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 15. en control speed chattering happens if stand ing lowering speed is slow when standing of en pin is lowered. the reverse current in which the input side and the pressure operation are done from the output side is generated when chattering operates with the output voltage remained, and there is a case to destruction. please set to stand within 100 s when you control on/off by the en signal. 16. about output voltage when en terminal on when restarting by en terminal , bd9329aefj starts from 0v. when an electric charg e is left in an output capacitance at this time, electric current discharge from an output capacitance is performed. when many electric charges are left in an output capacitance , this electrical current discharge be comes big, and bd9329aefj sometimes comes to destruction. therefore please do the discharge control to follow condition s of output voltage when en terminal on . in c ase of output capacit o r value is less than 100 f,: please set the output volta ge less than 2.0v when en terminal on. in case of output capacit or value is more than 100 f,: please set the output voltage based on the next f ormula . (output voltage when en terminal on [v]) < 9.15 x ( output capacitance [f] ) (- 0.33) 16/ 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 ordering information b d 9 3 2 9 a e f j - e 2 part numb er package efj : h t sop -j8 packaging and forming specification e2: embossed tape and reel marking diagram htsop - j8(top view) d9329a part number marking lot number 1pin mark 17/ 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 physical dimension tape and reel information package name htsop - j8 18/ 19
bd9329aefj ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 001 tsz02201 - 0323aaj00010 - 1 - 2 16.feb.2015 rev.003 revision history date revision changes 11.apr.2012 001 new release 0 3.sep .201 4 002 applied the rohm standard style and improved understandability . 16.feb .201 5 003 add ? 16. a bout output voltage when en terminal on ? in o pe rationa l notes 19/ 19
datasheet d a t a s h e e t notice-ge rev.004 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-ge rev.004 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd9329aefj package htsop-j8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bd9329aefj - web page

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